Pascal and Francis Bibliographic Databases

Help

Search results

Your search

kw.\*:("Silver alloys")

Document Type [dt]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Language

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Origin

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 25 of 2431

  • Page / 98
Export

Selection :

  • and

Hardness and microstructure of internally oxidized silver alloysPROROK, B. C; PARK, J. H; GORETTA, K. C et al.IEEE transactions on applied superconductivity. 2000, Vol 10, Num 1, pp 1178-1181, issn 1051-8223Conference Paper

Performance of a copper-silver alloy as an electromagnetic launcher conductor materialCASTRO-DETTMER, Zachira; PERSAD, Chadee.IEEE transactions on magnetics. 2005, Vol 41, Num 1, pp 176-181, issn 0018-9464, 6 p., 2Conference Paper

On the interaction mechanisms between a high-power diode laser source and silver alloys: The case of aesthetic weldingGISARIO, A; BARLETTA, M; STANCAMPIANO, R et al.Optics and lasers in engineering. 2009, Vol 47, Num 7-8, pp 821-830, issn 0143-8166, 10 p.Article

Determination of the atomic density and co-ordination parameters of non-crystalline materials from the diffraction dataILINSKII, A; KABAN, I; HOYER, W et al.Journal of non-crystalline solids. 2004, Vol 347, Num 1-3, pp 39-44, issn 0022-3093, 6 p.Article

Low temperature total electron yield EXAFS study of CoxAg1-x granular alloysREGNARD, J. R; JUANHUIX, J; BRIZARD, C et al.Solid state communications. 1996, Vol 97, Num 5, pp 419-423, issn 0038-1098Article

Multilayered artifacts in the pre-Columbian metallurgy from the North of PeruCESAREO, Roberto; BUSTAMANTE, Angel D; LEVANO, Edgard B et al.Applied physics. A, Materials science & processing (Print). 2013, Vol 113, Num 4, pp 889-903, issn 0947-8396, 15 p.Article

Tritium adsorption and diffusion of 25% silver palladium cathodic membranes for water processingBELLANGER, G; RAMEAU, J. J.Fusion technology. 1997, Vol 31, Num 2, pp 185-197, issn 0748-1896Article

Twin Knudsen cell configuration for activity measurements by mass spectrometryJACOBSON, N. S.High temperature and materials science. 1996, Vol 35, Num 1, pp 1-9, issn 1080-1278Article

Development of new kinetic Monte Carlo simulator for hydrogen diffusion process in palladium-silver alloysKUROKAWA, Hitoshi; BADA, Kazunori; KOYAMA, Michihisa et al.Applied surface science. 2005, Vol 244, Num 1-4, pp 636-639, issn 0169-4332, 4 p.Conference Paper

Experimental approach to shock synthesis using pressure-temperature-strain dataSTAUDHAMMER, K. P.Journal de physique. IV. 2006, Vol 134, pp 1161-1166, issn 1155-4339, 6 p.Conference Paper

Magnetoelasticity and the effect of internal stresses in AgNi multilayersPELOSIN, V; HILLAIRET, J; ULRICH, O et al.Journal of magnetism and magnetic materials. 1994, Vol 134, Num 1, pp 79-87, issn 0304-8853Article

Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal agingSHI, X. Q; KWAN, H. F; NAI, S. M. L et al.Journal of materials science. 2004, Vol 39, Num 3, pp 1095-1099, issn 0022-2461, 5 p.Article

Microstructure and viscosity of semi-solid mixturesBARBE, J. C; PEREZ, M; PAPOULAR, M et al.Journal of physics. Condensed matter (Print). 2000, Vol 12, Num 12, pp 2567-2577, issn 0953-8984Article

Determination of tritium adsorption and diffusion parameters in a palladium-silver alloy by electrochemical impedance analysisBELLANGER, G; RAMEAU, J. J.Fusion technology. 1997, Vol 32, Num 1, pp 94-106, issn 0748-1896Article

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structuresSTREHLE, S; MENZEL, S; JAHN, A et al.Microelectronic engineering. 2009, Vol 86, Num 12, pp 2396-2403, issn 0167-9317, 8 p.Article

Cyclic Voltammetric Studies of the Behavior of Lead-Silver Anodes in Zinc ElectrolytesZHANG, W; TU, C. Q; CHEN, Y. F et al.Journal of materials engineering and performance. 2013, Vol 22, Num 6, pp 1672-1679, issn 1059-9495, 8 p.Article

Monte Carlo simulation of hydrogen absorption in palladium and palladium-silver alloysKUROKAWA, Hitoshi; NAKAYAMA, Taku; KOBAYASHI, Yasunori et al.Catalysis today. 2003, Vol 82, Num 1-4, pp 233-240, issn 0920-5861, 8 p.Conference Paper

INTERACTION D'UNE DECHARGE D'ARC AVEC LA SURFACE D'UNE ELECTRODE DE MATERIAU COMPOSITE A BASE D'ARGENTPRAVOVEROV NL; AFONIN MP.1982; ELEKTROTEHNIKA (MOSK., 1963); ISSN 0013-5860; SUN; DA. 1982; NO 7; PP. 46-50; BIBL. 8 REF.Article

A comparison of Ag/W, Ag/WC, and Ag/Mo electrical contactsCHI-HUNG LEUNG; KIM, H. J.IEEE transactions on components, hybrids, and manufacturing technology. 1984, Vol 7, Num 1, pp 69-75, issn 0148-6411Article

Postheat treatment of silver halide hologramsGUO, C. S; CAI, L. Z.Optics letters. 1991, Vol 16, Num 22, pp 1777-1779, issn 0146-9592Article

Fügen von Silber-kadminmoxid-Kontaktwerkstoffen = Assemblage de matériaux pour contacts électriques à base d'AgCdO = Joining of silver-cadmium oxide contact materialsMÜLLER, W; PFANNKUCHEN, H.Schweisstechnik (Berlin, DDR). 1985, Vol 35, Num 8, pp 354-355, issn 0036-7192Article

Results of copper-silver rail materials testsCASTRO, Zachira; PERSAD, Chadee.IEEE transactions on magnetics. 2007, Vol 43, Num 1, pp 116-119, issn 0018-9464, 4 p., 2Conference Paper

Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactionsTONG, H. D; GIELENS, F. C; BERENSCHOT, J. W et al.Proceedings, IEEE micro electro mechanical systems. 2002, pp 268-271, issn 1084-6999, isbn 0-7803-7185-2, 4 p.Conference Paper

Electronic and ionic processes in sensitized silver halide systemsMITCHELL, J. W.Journal of imaging science. 1991, Vol 35, Num 6, pp 341-350, issn 8750-9237Article

THE STRUCTURE OF ORDERED AG3MG BY ELECTRON DIFFRACTION: KINEMATICAL VERSUS DYNAMICAL DIFFRACTION CALCULATIONSGUYMONT M; GRATIAS D.1979; J. MICR. SPECTR. ELECTRON.; FRA; DA. 1979; VOL. 4; NO 3; PP. 203-212; BIBL. 9 REF.Article

  • Page / 98